VeriSilicon Unveils Advanced Wireless IP for IoT Devices

In an era where the Internet of Things (IoT) is reshaping daily life, the demand for seamless, energy-efficient connectivity has never been more critical, with billions of devices expected to join the global network in the coming years. VeriSilicon has stepped into this dynamic landscape with a groundbreaking wireless IP platform tailored for IoT and consumer electronics, promising to redefine chip development for connected devices. Built on GlobalFoundries’ 22FDX® (22nm FD-SOI) process technology, this innovative solution prioritizes high integration, low power consumption, and silicon-proven reliability. It addresses the urgent need for multi-standard connectivity in rapidly evolving markets, offering a robust foundation for customers to design chips swiftly and effectively. This development marks a significant milestone in enabling diverse applications, from smart home gadgets to industrial sensors, ensuring that technology keeps pace with the expanding digital ecosystem. The focus on energy efficiency and adaptability positions this platform as a game-changer for future innovations.

Cutting-Edge Features of the Wireless Platform

The newly introduced platform by VeriSilicon encompasses a comprehensive suite of intellectual property (IP) solutions designed to support an array of wireless standards critical for modern IoT applications. This includes Bluetooth Low Energy (BLE), Bluetooth Dual Mode (BTDM), NB-IoT, and LTE Cat.1/Cat.4, alongside RF, baseband, and software protocol stacks. Additionally, it integrates RF IPs for GNSS, Wi-Fi 802.11ah, and 802.15.4g, many of which have already been embedded in customer products and achieved mass production. The platform’s design leverages the unique advantages of FD-SOI technology, offering superior power efficiency and integration capabilities. This enables clients to create competitive microcontrollers (MCUs) and system-on-chips (SoCs) for a wide range of uses, from low-power BLE MCUs to high-precision GNSS SoCs, ensuring versatility across consumer and industrial sectors. Such a broad spectrum of supported technologies underscores the platform’s role in accelerating product development.

Beyond its technical specifications, the platform has already demonstrated substantial market impact, with customers shipping over 100 million chips based on these designs. This achievement reflects significant validation and recognition within the industry, highlighting the reliability and effectiveness of VeriSilicon’s solutions. Applications span diverse fields, including Wi-Fi-enabled home security cameras and other connected devices that demand both performance and energy efficiency. The ability to cater to short, medium, and long-range connectivity standards ensures that manufacturers can address varied consumer needs without compromising on quality or cost. Moreover, the emphasis on low power consumption aligns with global trends toward sustainability, making the platform a preferred choice for companies aiming to reduce their environmental footprint while maintaining cutting-edge functionality. This balance of innovation and practicality sets a new benchmark for wireless IP solutions.

Strategic Technology and Industry Collaboration

A cornerstone of this platform’s success lies in the strategic use of GlobalFoundries’ 22FDX® process technology, which blends low power, high performance, and cost efficiency—key attributes for today’s connected devices. Industry leaders have lauded this collaboration, with Ed Kaste, Senior Vice President at GlobalFoundries, noting the technology’s capacity to enable flexible, high-performance solutions. Similarly, Wiseway Wang, Executive Vice President at VeriSilicon, emphasized the adaptability of the platform in meeting the rising demand for multi-standard connectivity. This partnership reflects a shared commitment to pushing the boundaries of innovation in IoT and consumer electronics through advanced semiconductor technologies. By combining expertise and resources, the collaboration ensures that the resulting platform not only meets current market needs but also anticipates future challenges, fostering a forward-thinking approach to chip design.

VeriSilicon’s deep-rooted experience with FD-SOI technology further strengthens its position as an industry leader, having licensed over 60 FD-SOI IPs to numerous clients across a decade of innovation. The company pioneered the successful implementation of FD-SOI Adaptive Body Biasing (ABB) technology in mass-produced chips, tailoring solutions for a wide array of industries, including satellites, automotive, and smart glasses. This versatility demonstrates the scalability of the platform, capable of supporting both niche and mainstream applications. Looking ahead, plans to explore emerging fields such as Wi-Fi 6, satellite communications, and millimeter-wave radar indicate a proactive stance in shaping the future of connectivity. Such initiatives ensure that VeriSilicon remains at the forefront of technological advancements, ready to address the evolving demands of an increasingly connected world with innovative and efficient solutions.

Shaping the Future of Connected Solutions

Reflecting on this landmark announcement, VeriSilicon’s wireless IP platform emerged as a pivotal advancement in the realm of IoT and consumer electronics, driven by the robust capabilities of GlobalFoundries’ 22FDX® technology. It delivered a comprehensive set of IPs that supported diverse wireless standards, empowering a multitude of applications with energy-efficient and highly integrated designs. The remarkable milestone of over 100 million chips shipped stood as a testament to its market success and reliability. Moving forward, the focus shifts to leveraging this foundation to explore untapped potential in emerging technologies. Industry stakeholders are encouraged to consider how such platforms can streamline development cycles and reduce costs while maintaining high performance. As connectivity continues to evolve, adopting adaptable and sustainable solutions like this will be crucial for staying competitive in a fast-paced digital landscape, paving the way for smarter, more efficient devices.

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